Patent Assignment
Reel/Frame 014592/0260
Assignment of Assignor's Interest
Recorded: 2003-10-15
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(11)
Data Processor and Data Processing System
Patent:
6,813,697 →
Application:
09/679,349 →
A method of manufacturing a semiconductor device
Application:
09/934,651 →
Publication:
US 2002/0039811
Method of Dicing to Form Encapulated Semiconductor Device
Semiconductor Utilizing Grooves in Lead and Tab Portions of Lead Frame to Prevent Peel Off Between the Lead Frame and the Resin.
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Electronic device and a method of manufacturing the same
Application:
10/152,839 →
Publication:
US 2002/0135986
Manufacturing Method of a Block Molding Semiconductor Device Divided by Dicing Blade
Application:
10/157,823 →
Publication:
US 2003/0006492
Semiconductor Device
Semiconductor device and method of manufacturing the same
Application:
10/279,986 →
Publication:
US 2003/0145461
Method of Making Electronic Device
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 19, 2003
From: TOMIHARA, SEIICHI
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 014194/0234 →
Assignment of Assignor's Interest
Jun 25, 2003
From: HASEBE, HAJIME; DANNO, TADATOSHI; SATOU, YUKIHIRO
To: HITACHI LTD; HITACHI HOKKAI SEMICONDUCTOR LTD.
Reel/Frame 014211/0795 →
Assignment of Assignor's Interest
Sep 22, 2003
From: NAKAMURA, SHIGERU; GOTOU, MASAKATSU
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 014520/0764 →
Assignment of Assignor's Interest
Sep 22, 2003
From: ARAI, HIROSHI; NAGASHIMA, NOBUAKI; KASAI, NORIHIKO; SEKI, ISAO
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 014508/0929 →
Assignment of Assignor's Interest
Sep 22, 2003
From: OGASAWARA, KAZUTO; TANAKA, MITSUGU; TOMIHIRA, SEIICHI
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 014521/0926 →
Assignment of Assignor's Interest
Sep 22, 2003
From: KASAI, NORIHIKO; OHNO, HIROMASA
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 014521/0947 →
Assignment of Assignor's Interest
Sep 23, 2003
From: FUJISAWA, ATSUSHI
To: HITACHI, LTD.; HITACHI HOKHAI SEMICONDUCTOR, LTD.
Reel/Frame 014521/0951 →
Assignment of Assignor's Interest
Sep 25, 2003
From: TOMONAGA, KAZUHIRO; IWATA, KATSUMI
To: HITACHI, LTD.
Reel/Frame 014528/0036 →
Assignment of Assignor's Interest
Jun 19, 2006
From: TOMIHARA, SEIICHI
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 018641/0577 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger and Change of Name
Feb 26, 2015
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035100/0276 →
Merger
Feb 26, 2015
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 035036/0529 →
Merger
Feb 26, 2015
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 035036/0484 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger and Change of Name
May 12, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.; NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0109 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Absorption-Type Merger
Dec 5, 2019
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 051201/0001 →