Patent Assignment
Reel/Frame 014194/0234
Assignment of Assignor's Interest
Recorded: 2003-06-19
Pages: 2
Assignor
TOMIHARA, SEIICHI
Executed: 2001-08-29
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR, LTD.
145, AZANAKAJIMA, NANAECHO, KAMEDA-GUN, HOKKAIDO, JAPAN
Covered Property
(1)
Method of Dicing to Form Encapulated Semiconductor Device
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014592/0260 →
Assignment of Assignor's Interest
Jun 19, 2006
From: TOMIHARA, SEIICHI
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 018641/0577 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger and Change of Name
May 12, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.; NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0109 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →