Patent Assignment
Reel/Frame 014211/0795
Assignment of Assignor's Interest
Recorded: 2003-06-25
Pages: 2
Assignors
HASEBE, HAJIME
Executed: 2001-11-01
DANNO, TADATOSHI
Executed: 2001-11-08
SATOU, YUKIHIRO
Executed: 2001-11-08
Assignees
HITACHI LTD
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR LTD.
145, AZANAKAJIMA, NANAECHO, KAMEDA-GUN HOKKAIDO, JAPAN
Covered Property
(1)
Semiconductor Utilizing Grooves in Lead and Tab Portions of Lead Frame to Prevent Peel Off Between the Lead Frame and the Resin.
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014592/0260 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger
Feb 26, 2015
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 035036/0529 →
Merger and Change of Name
Feb 26, 2015
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035100/0276 →
Merger
Feb 26, 2015
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 035036/0484 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Absorption-Type Merger
Dec 5, 2019
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 051201/0001 →