IP Library › Assignment 035036/0529
Patent Assignment
Reel/Frame 035036/0529

Merger

Recorded: 2015-02-26 Pages: 27
Assignor
Assignee
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
111, NISHI YOKOTE-MACHI, TAKASAKI-SHI, GUNMA, JAPAN
Covered Properties (14)
Semiconductor Utilizing Grooves in Lead and Tab Portions of Lead Frame to Prevent Peel Off Between the Lead Frame and the Resin.
Patent: 6,713,849 →
Application: 09/988,644 →
Publication: US 2002/0084518
Semiconductor Device
Patent: 7,518,156 →
Application: 10/664,978 →
Publication: US 2004/0056337
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Patent: 7,804,159 →
Application: 10/879,010 →
Publication: US 2004/0232442
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Patent: 7,777,312 →
Application: 12/222,099 →
Publication: US 2008/0296784
Semiconductor Device
Patent: 7,911,054 →
Application: 12/410,946 →
Publication: US 2009/0189260
Semiconductor Device
Patent: 7,821,119 →
Application: 12/610,900 →
Publication: US 2010/0044854
Semiconductor Device
Patent: 8,115,298 →
Application: 12/897,221 →
Publication: US 2011/0018122
Semiconductor Device
Patent: 8,044,509 →
Application: 12/982,432 →
Publication: US 2011/0095412
Semiconductor Device
Patent: 8,581,396 →
Application: 13/240,124 →
Publication: US 2012/0007224
Semiconductor Device
Patent: 8,618,642 →
Application: 13/240,132 →
Publication: US 2012/0007225
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Patent: 8,637,965 →
Application: 13/357,076 →
Publication: US 2012/0146228
Semiconductor Device
Patent: 9,496,204 →
Application: 14/090,295 →
Publication: US 2014/0084440
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Patent: 8,969,138 →
Application: 14/108,507 →
Publication: US 2014/0106509
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Patent: 9,484,288 →
Application: 14/623,032 →
Publication: US 2015/0228558
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2003
From: HASEBE, HAJIME; DANNO, TADATOSHI; SATOU, YUKIHIRO
To: HITACHI LTD; HITACHI HOKKAI SEMICONDUCTOR LTD.
Reel/Frame 014211/0795 →
Assignment of Assignor's Interest Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014592/0260 →
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Change of Name Feb 26, 2015
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035100/0297 →
Merger and Change of Name Feb 26, 2015
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035100/0276 →
Merger Feb 26, 2015
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 035036/0484 →
Merger Feb 26, 2015
From: HITACHI YONEZAWA ELECTRONICS CO., LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 035100/0259 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Absorption-Type Merger Dec 5, 2019
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 051201/0001 →