Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
View Patent ↗A semiconductor device is disclosed which includes a tab ( 5 ) for use in supporting a semiconductor chip ( 8 ), a seal section ( 12 ) as formed by sealing the semiconductor chip ( 8 ) with a resin material, more than one tab suspension lead ( 4 ) for support of the tab ( 5 ), a plurality of electrical leads ( 2 ) which have a to-be-connected portion as exposed to outer periphery on the back surface of the seal section ( 12 ) and a thickness reduced portion as formed to be thinner than said to-be-connected portion and which are provided with an inner groove ( 2 e ) and outer groove ( 2 f ) in a wire bonding surface ( 2 d ) as disposed within the seal section ( 12 ) of said to-be-connected portion, and wires ( 10 ) for electrical connection between the leads ( 2 ) and pads ( 7 ) of the semiconductor chip ( 8 ), wherein said thickness reduced portion of the leads ( 2 ) is covered by or coated with a sealing resin material while causing the wires ( 10 ) to be contacted with said to-be-connected portion at specified part lying midway between the outer groove ( 2 f ) and inner groove ( 2 e ) to thereby permit said thickness reduced portion of leads ( 2 ) and the outer groove ( 2 f ) plus the inner groove ( 2 e ) to prevent occurrence of any accidental lead drop-down detachment.
1. A semiconductor device comprising:
a tab having a first upper surface and a first lower surface opposing to the first upper surface;
a plurality of leads having a second upper surface arranged in the same direction as the first upper surface of the tab, and a second lower surface opposing to the second upper surface, and arranged around the tab;
a plurality of suspension leads supporting the tab, and having a third upper surface arranged in the same direction as the first upper surface of the tab, and a third lower surface opposing to the third upper surface;
a semiconductor chip having a front surface, a plurality of connection pads formed on the front surface, and a back surface opposing to the front surface, and mounted on the first upper surface of the tab via an adhesive layer such that a central part of the semiconductor chip overlaps with the tab in a plan view;
a plurality of wires only coupling the connection pads of semiconductor chip with the electrical leads; and
a seal portion sealing the tab, the semiconductor chip, the wires, the suspension leads and the leads such that the second lower surface of each of the leads and the third lower surface of a part of each of the suspension leads are exposed from the seal portion;
wherein the suspension leads are not bent in a thickness direction of the suspension leads, respectively;
wherein the seal portion has a front surface arranged in the same direction as the first upper surface of the tab, a rear surface opposing to the front surface of the seal portion, and side surfaces locating between the front surface of the seal portion and the rear surface of the seal portion;
wherein a thickness of each of the tab and other part of each of the suspension leads is thinner than that of each of the leads;
wherein an entire first lower surface of the tab and the third lower surface of the other part of each of the suspension leads are covered with the sealing portion;
wherein a thickness of the seal portion between the first lower surface of the tab and the rear surface of the seal portion is thinner than that of the sealing portion between the front surface of the semiconductor chip and the front surface of the seal portion;
wherein the seal portion is formed such that the second lower surface of each of the leads and the third lower surface of the part of each of the suspension leads are exposed from the rear surface of the seal portion; and
wherein the seal portion is formed such that the second lower surface of each of the leads and the third lower surface of the part of each of the suspension leads are located in the substantially same plane as the rear surface of the seal portion.
2. A semiconductor device according to claim 1 , wherein a groove portion is formed on the second upper surface of each of the leads; and
wherein an inner portion of the groove portion is sealed with the seal portion.
3. A semiconductor device according to claim 1 , wherein the tab, the suspension leads and the leads are made of copper-based or iron-based metals.
4. A semiconductor device according to claim 1 , wherein the sealing portion is made of epoxy resin.
5. A semiconductor device according to claim 1 , wherein a thickness of a part of each of the leads is thinner than that of other part of each of the leads; and
wherein the other part of the leads faces to the tab, respectively.
6. A semiconductor device according to claim 1 , wherein the first upper surface of the tab and the third upper surface of the suspension leads are located in a same plane as the second upper surface of the leads, respectively.
7. A semiconductor device according to claim 1 , wherein a size of the tab is smaller than that of the semiconductor chip in a plan view.