Patent Assignment
Reel/Frame 035100/0259
Merger
Recorded: 2015-02-26
Pages: 13
Assignor
HITACHI YONEZAWA ELECTRONICS CO., LTD.
Executed: 2002-10-01
Assignee
NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
39, 1007, IZUMISAWA, CHITOSE-SHI, HOKKAI-DO, JAPAN
Covered Properties
(7)
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Semiconductor Device and a Method of Manufacturing the Same and a Mounting Structure of a Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger
Feb 26, 2015
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 035036/0484 →
Merger
Feb 26, 2015
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 035036/0529 →
Change of Name
Feb 26, 2015
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 035100/0297 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Absorption-Type Merger
Dec 5, 2019
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 051201/0001 →