Patent Assignment
Reel/Frame 035100/0276
Merger and Change of Name
Recorded: 2015-02-26
Pages: 14
Assignor
HITACHI HOKKAI SEMICONDUCTOR, LTD.
Executed: 2003-04-01
Assignee
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
39, 1007, IZUMISAWA, CHITOSE-SHI, HOKKAI-DO, JAPAN
Covered Properties
(7)
Semiconductor Utilizing Grooves in Lead and Tab Portions of Lead Frame to Prevent Peel Off Between the Lead Frame and the Resin.
Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2003
From: HASEBE, HAJIME; DANNO, TADATOSHI; SATOU, YUKIHIRO
To: HITACHI LTD; HITACHI HOKKAI SEMICONDUCTOR LTD.
Reel/Frame 014211/0795 →
Assignment of Assignor's Interest
Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014592/0260 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger
Feb 26, 2015
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 035036/0529 →
Merger
Feb 26, 2015
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 035036/0484 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Absorption-Type Merger
Dec 5, 2019
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 051201/0001 →