Patent Assignment
Reel/Frame 014535/0579
Assignment of Assignor's Interest
Recorded: 2003-09-26
Pages: 3
Assignor
ASAI, MOTOO
Executed: 2003-06-17
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU 503-8004, JAPAN
Covered Property
(1)
Substrate for Mounting Ic Chip, Multilayered Printed Circuit Board, and Device for Optical Communication