Patent Assignment
Reel/Frame 014536/0250
Assignment of Assignor's Interest
Recorded: 2003-09-23
Pages: 3
Assignors
CHO, SUNG-DAE
Executed: 2003-08-14
KIM, SANG-JUN
Executed: 2003-08-14
LEE, JOO-HYUNG
Executed: 2003-08-14
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, PALDAL-KU, SUWON, KYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Pattern Leads and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.