Patent Assignment
Reel/Frame 014546/0393
Security Interest
Recorded: 2004-04-23
Received: 2004-04-23
Pages: 16
Assignor
CLARISAY, INC.
Executed: 2004-01-14
Assignee
JEWELL, ROY
10110 RACLIFFE DRIVE, TAMPA, FL, 33626, UNITED STATES
Covered Properties
(20)
Flexible Circuit Connector for Stacked Chip Module
Application:
10/449,242 →
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
10/271,392 →
Hermetic Package for Surface Acoustic Wave Device Having Exposed Device Substrate Contacts and Method of Manufacturing the Same
Application:
10/003,157 →
Wrap Path for Communication Ring Access Control
Application:
10/093,762 →
Hermetic Package for Multiple Contact-Sensitive Electronic Devices and Methods of Manufacturing Thereof
Application:
09/998,368 →
Hermetic Package for Pyroelectric-Sensitive Electronic Device and Method of Manufacturing the Same
Application:
09/997,860 →
Hermetic Package for Surface Acoustic Wave Device and Method of Manufacturing the Same
Application:
09/997,971 →
Method for Automatic Resource Reservation and Communication That Facilitates Using Multiple Processing Events for a Single Processing Task
Application:
09/919,283 →
Enhancing Performance by Pre-Fetching and Caching Data Directly in a Communication Processor's Register Set
Application:
09/919,216 →
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
09/821,592 →
Communication Packet Processor with a Look-Up Engine and Content-Addressable Memory for Storing Summation Blocks of Context Information for a Core Processor
Application:
09/802,218 →
Communication Packet Processor with a Look-Up Engine and Content-Addressable Memory for Modifying Selectors to Retrieve Context Information for a Core Processor
Application:
09/802,216 →
Content-Addressable Memory for Use with a Communication Packet Processor to Retrieve Context Information
Application:
09/802,159 →
Communication Packet Processor with a Look-Up Engine and Content-Addressable Memory for Retrieving Context Information for a Core Processor
Application:
09/802,194 →
Communication Packet Processor with a Look-Up Engine and Content -Addressable Memory for Updating Context Information for a Core Processor
Application:
09/802,217 →
High Density Integrated Circuit Module
Application:
09/761,210 →
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
09/755,018 →
System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device
Application:
09/755,992 →
Module having integral surface acoustic wave circuits and method of manufacturing the same
Application:
09/755,981 →
Hermetically Sealed Dual-Band Surface Acoustic Wave Circuit Module
Application:
09/755,991 →