IP Library › Granted Patent US 6,495,398
Granted Patent Utility
US 6,495,398 · Confirmation No. 4525

WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME

Inventor: Martin Goetz
Patented Case View Patent ↗
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 Code Description Pages PDF
2009-02-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-02-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-01-26 PA.. Power of Attorney 4 View
2009-01-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-01-05 TRNA Transmittal of New Application 1 View
2001-01-05 SPEC Specification 17 View
2001-01-05 CLM Claims 7 View
2001-01-05 ABST Abstract 1 View
2001-01-05 DRW Drawings-only black and white line drawings 5 View
2001-01-05 TRNA Transmittal of New Application 1 View
2001-01-05 SPEC Specification 17 View
2001-01-05 CLM Claims 7 View
2001-01-05 ABST Abstract 1 View
2001-01-05 DRW Drawings-only black and white line drawings 5 View
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Quick Facts
Patent No.
US 6,495,398
App. No.
09/755,018
Filed
2001-01-05
Granted
2002-12-17
Art Unit
2818
PTA
-68 days