Release of Security Interest

Recorded: 2008-12-04 Received: 2008-12-04 Pages: 6

Assignor

JEWELL, ROY

Executed: 2008-04-17

Assignee

CLARISAY, INC.

2626 HOWELL STREET, SUITE 840, DALLAS, TX, 75204, UNITED STATES

Covered Properties (9)

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 10/271,392 →

Hermetic Package for Surface Acoustic Wave Device Having Exposed Device Substrate Contacts and Method of Manufacturing the Same

Application: 10/003,157 →

Hermetic Package for Multiple Contact-Sensitive Electronic Devices and Methods of Manufacturing Thereof

Application: 09/998,368 →

Hermetic Package for Pyroelectric-Sensitive Electronic Device and Method of Manufacturing the Same

Application: 09/997,860 →

Hermetic Package for Surface Acoustic Wave Device and Method of Manufacturing the Same

Application: 09/997,971 →

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 09/821,592 →

Proteins for Use as Pitch and Stickies Control Agents in Pulp and Papermaking Processes

Application: 09/815,367 →

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 09/755,018 →

System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device

Application: 09/755,992 →