Assignment of Assignor's Interest

Recorded: 2009-01-21 Received: 2009-01-21 Pages: 9

Assignor

MOUNT HAMILTON PARTNERS, LLC

Executed: 2008-12-12

Assignee

MASSIMO DIN SOLUTIONS, LLC

160 GREENTREE DRIVE, SUITE 101, DOVER, DE, 19904, UNITED STATES

Covered Properties (11)

Method for Forming a Multi-Frequency Surface Acoustic Wave Device

Application: 11/986,788 →

Method for Forming a Multi-Frequency Surface Acoustic Wave Device

Application: 10/288,529 →

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 10/271,392 →

Hermetic Package for Surface Acoustic Wave Device Having Exposed Device Substrate Contacts and Method of Manufacturing the Same

Application: 10/003,157 →

Hermetic Package for Multiple Contact-Sensitive Electronic Devices and Methods of Manufacturing Thereof

Application: 09/998,368 →

Hermetic Package for Pyroelectric-Sensitive Electronic Device and Method of Manufacturing the Same

Application: 09/997,860 →

Hermetic Package for Surface Acoustic Wave Device and Method of Manufacturing the Same

Application: 09/997,971 →

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 09/821,592 →

Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same

Application: 09/755,018 →

System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device

Application: 09/755,992 →

System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device

Application: 09/755,980 →