Patent Assignment
Reel/Frame 021411/0084
Assignment of Assignor's Interest
Recorded: 2008-08-19
Received: 2008-08-19
Pages: 4
Assignor
Assignee
MOUNT HAMILTON PARTNERS, LLC
650 CASTRO STREET, SUITE 120-333, MOUNTAIN VIEW, CA, 94041, UNITED STATES
Covered Properties
(9)
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
10/271,392 →
Hermetic Package for Surface Acoustic Wave Device Having Exposed Device Substrate Contacts and Method of Manufacturing the Same
Application:
10/003,157 →
Hermetic Package for Multiple Contact-Sensitive Electronic Devices and Methods of Manufacturing Thereof
Application:
09/998,368 →
Hermetic Package for Pyroelectric-Sensitive Electronic Device and Method of Manufacturing the Same
Application:
09/997,860 →
Hermetic Package for Surface Acoustic Wave Device and Method of Manufacturing the Same
Application:
09/997,971 →
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
09/821,592 →
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
09/755,018 →
System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device
Application:
09/755,992 →
System and Method for Dissipating Static Charge Generated in a Surface Acoustic Wave Device
Application:
09/755,980 →