Patent Assignment
Reel/Frame 014546/0415
Assignment of Assignor's Interest
Recorded: 2003-10-03
Pages: 9
Assignor
NANOVIA LP
Executed: 2003-09-25
Assignee
HITACHI DIGITAL GRAPHICS (USA), INC.
2325 PARAGON DRIVE, SUITE #10, SAN JOSE, CALIFORNIA, 95131
Covered Properties
(3)
Method and apparatus for ablating high-density array of vias or indentation in surface of object
Patent:
6,310,701 →
Application:
09/514,084 →
Control System for Ablating High-Density Array of Vias or Indentation in Surface of Object
Patent:
6,420,675 →
Application:
09/540,366 →
Apparatus for ablating high-density array of vias or indentation in surface of object
Patent:
6,256,121 →
Application:
09/540,367 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 28, 2000
From: LIZOTTE, TODD E.
To: NANOVIA LP
Reel/Frame 010596/0424 →
Assignment of Assignor's Interest
Mar 31, 2000
From: LIZOTTE, TODD E.; OHAR, OREST; WATERS, SUNNY COLLAR
To: NANOVIA, LP
Reel/Frame 010671/0473 →
Assignment of Assignor's Interest
Mar 31, 2000
From: LIZOTTE, TODD E.; OHAR, OREST
To: NANOVIA, LP
Reel/Frame 010722/0820 →
Assignment of Assignor's Interest
Apr 6, 2004
From: HITACHI DIGITAL GRAPHICS (USA), INC.
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015177/0122 →