IP Library › Assignment 015177/0122
Patent Assignment
Reel/Frame 015177/0122

Assignment of Assignor's Interest

Recorded: 2004-04-06 Pages: 10
Assignor
Assignee
HITACHI VIA MECHANICS, LTD.
2100 KAMI-IMAIZUMI, EBINA-SHI, KANAGAWA, 243-0488, JAPAN
Covered Properties (4)
Method and apparatus for ablating high-density array of vias or indentation in surface of object
Patent: 6,310,701 →
Application: 09/514,084 →
Control System for Ablating High-Density Array of Vias or Indentation in Surface of Object
Patent: 6,420,675 →
Application: 09/540,366 →
Apparatus for ablating high-density array of vias or indentation in surface of object
Patent: 6,256,121 →
Application: 09/540,367 →
Control System for Ablating High-Density Array of Vias or Indentation in Surface of Object
Patent: 6,653,593 →
Application: 10/183,806 →
Publication: US 2002/0162825
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 28, 2000
From: LIZOTTE, TODD E.
To: NANOVIA LP
Reel/Frame 010596/0424 →
Assignment of Assignor's Interest Mar 31, 2000
From: LIZOTTE, TODD E.; OHAR, OREST
To: NANOVIA, LP
Reel/Frame 010722/0820 →
Assignment of Assignor's Interest Mar 31, 2000
From: LIZOTTE, TODD E.; OHAR, OREST; WATERS, SUNNY COLLAR
To: NANOVIA, LP
Reel/Frame 010671/0473 →
Assignment of Assignor's Interest Jun 26, 2002
From: LIZOTTE, TODD E.; OHAR, OREST
To: NANOVIA, LP
Reel/Frame 013062/0152 →
Assignment of Assignor's Interest Oct 3, 2003
From: NANOVIA LP
To: HITACHI DIGITAL GRAPHICS (USA), INC.
Reel/Frame 014546/0415 →
Assignment of Assignor's Interest Oct 3, 2003
From: NANOVIA LP
To: HITACHI DIGITAL GRAPHICS (USA) INC.
Reel/Frame 014549/0890 →
Assignment of Assignor's Interest Apr 6, 2004
From: HITACHI DIGITAL GRAPHICS (USA), INC.
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015178/0326 →