Patent Assignment
Reel/Frame 014547/0435
Assignment of Assignor's Interest
Recorded: 2003-09-30
Received: 2003-10-06
Pages: 3
Assignor
AGERE SYSTEMS INC.
Executed: 2003-02-26
Assignee
TRIQUINT TECHNOLOGY HOLDING CO.
2300 NORTHEAST BROOKWOOD PARKWAY, HILLSBORO, OR, 97124, UNITED STATES
Covered Property
(1)
Method for Reducing Thermal Loss and Providing Mechanical Compliance in a Semiconductor Package and the Semiconductor Package Formed Therefrom
Application:
09/781,995 →