IP Library › Granted Patent US 6,549,550
Granted Patent Utility
US 6,549,550 · Confirmation No. 2039

METHOD FOR REDUCING THERMAL LOSS AND PROVIDING MECHANICAL COMPLIANCE IN A SEMICONDUCTOR PACKAGE AND THE SEMICONDUCTOR PACKAGE FORMED THEREFROM

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⬇ PDF
 Code Description Pages PDF
2001-02-14 TRNA Transmittal of New Application 2 View
2001-02-14 SPEC Specification 9 View
2001-02-14 CLM Claims 4 View
2001-02-14 ABST Abstract 1 View
2001-02-14 DRW Drawings-only black and white line drawings 4 View
2001-02-14 OATH Oath or Declaration filed 6 View
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Quick Facts
Patent No.
US 6,549,550
App. No.
09/781,995
Filed
2001-02-14
Granted
2003-04-15
Pub. No.
US20020110163A1
Art Unit
2828
PTA
-49 days