Patent Assignment
Reel/Frame 026109/0478
Merger
Recorded: 2011-03-28
Pages: 8
Assignor
TRIQUINT TECHNOLOGY HOLDING CO., A DELAWARE CORPORATION
Executed: 2010-06-22
Assignee
TRIQUINT SEMICONDUCTOR, INC., A DELAWARE CORPORATION
2300 NE BROOKWOOD PARKWAY, HILLSBORO, OREGON, 97124
Covered Properties
(71)
Waveguide Structure Using Polymer Material and Method
Patent:
6,856,734 →
Application:
09/134,121 →
Uncooled Universal Laser Module
Patent:
6,618,407 →
Application:
09/141,143 →
Barrier Layer and Method of Making the Same
Patent:
6,590,913 →
Application:
09/312,435 →
Voltage Control of Optical Receiver Bandwidth
Patent:
6,624,918 →
Application:
09/349,570 →
Vertical Cavity Surface Emitting Laser Array and a Process for Making Same
Patent:
6,560,262 →
Application:
09/370,667 →
Multimode Fiber Communication System with Enhanced Bandwidth
Patent:
6,580,543 →
Application:
09/465,468 →
Method and Apparatus to Select Optimal Operating Conditions in a Digital Wavelength Stabilized Control System
Patent:
6,535,532 →
Application:
09/475,606 →
Optical Assembly
Patent:
6,920,168 →
Application:
09/510,038 →
Method and Device for Preventing Zinc/Iron Interaction in a Semiconductor Laser
Patent:
6,556,605 →
Application:
09/515,102 →
Optical Waveguide Based Power and Wavelength Monitor
Patent:
6,577,399 →
Application:
09/535,416 →
Passivated Optical Device and Method of Forming the Same
Patent:
6,744,796 →
Application:
09/538,446 →
E-Beam Deposition Method and Apparatus for Providing High Purity Oxide Films
Patent:
6,638,857 →
Application:
09/538,690 →
Dopant Diffusion Blocking for Optoelectronic Devices Using Inalas and/or Ingaalas
Patent:
6,664,605 →
Application:
09/539,882 →
Dopant Diffusion Barrier Layer for Use in Iii-V Structures
Patent:
6,819,695 →
Application:
09/540,471 →
High-Power and High Efficiency Large Area Single-Mode Laser
Patent:
6,574,262 →
Application:
09/545,473 →
Method of Forming a Laser Circuit Having Low Penetration Ohmic Contact Providing Impurity Gettering and the Resultant Laser Circuit
Patent:
6,555,457 →
Application:
09/545,494 →
Process for Obtaining Ultra-Low Reflectivity Facets for Electro-Absorption Modulated Lasers
Patent:
6,542,533 →
Application:
09/545,765 →
Apparatus and Method for Minimizing Wavelength Chirp of Laser Devices
Patent:
6,678,301 →
Application:
09/616,537 →
Compression Bonding Method Using Laser Assisted Heating
Patent:
6,582,548 →
Application:
09/628,063 →
Application of Inaias Double-Layer to Block Dopant Out-Diffusion in Iii-V Device Gabrication
Patent:
6,706,542 →
Application:
09/645,913 →
Method for Making a Planar Waveguide
Patent:
6,628,876 →
Application:
09/663,013 →
Aging in Tunable Semiconductor Lasers
Patent:
6,829,262 →
Application:
09/668,675 →
Feedback Control Loop Operating System for Tunable Source
Patent:
6,839,364 →
Application:
09/672,050 →
Resonance Elimination in High Speed Packages
Patent:
6,545,573 →
Application:
09/679,325 →
High Precision Laser Bar Test Fixture
Semiconductor Optical Devices
Optical Device Package with Hermetically Bonded Fibers
An Optical Device Having a Reference Mark System
Thin Film Lithium Niobate Structure and Method of Making the Same
Optoelectronic Receiver and Method of Signal Adjustment
Optical Combiner System and Method
Method for Reducing Thermal Loss and Providing Mechanical Compliance in a Semiconductor Package and the Semiconductor Package Formed Therefrom
Optical Component Package
Broadband Mode Converter
Passively Output Flattened Optical Amplifier
Double Layer Beam Expander for Device-to-Fiber Coupling
Optical Fiber Assembly and Method for Suppressing Optical Instabilities Due to Improperly Cured Epoxy
Method and Apparatus for Stabilizing Laser Wavelength
Optoelectronic Device Having a P-Contact and an N-Contact Located Over a Same Side of a Substrate and a Method of Manufacture Therefor
Broadband Matching Network for an Electroabsorption Optical Modulator
Non-Hermetic Packaging for Lithium Niobate-Based Devices
Optoelectronic Device Having an Integrated Capacitor Formed Thereon and Method of Manufacturing the Same
Externally Aligned Laser Module
Integrated Optoelectronics Devices
Optical Device with a Temperature Insensitive Optical Pathlength
Wavelength Tunable Laser and Method of Formation
Method and Apparatus for Locking the Transmission Wavelength in Optical Communication Laser Packages
Process for Fabricating an Article Comprising a Magneto-Optic Garnet Material
Optoelectronic Device and Method of Manufacture Thereof
Ultra-High Frequency Interconnection Using Micromachined Substrates
Optical Wavelength Locker Module Having a High Thermal Conductive Material
Optoelectronic Device Having a Barrier Layer Associated Therewith and a Method of Manufacture Thereof
Off-Axis Silicon Substrate for Optimized Optical Coupling
Apparatus and Method for Compensating for Age Induced Wavelength Drift in Tunable Semiconductor Lasers
Optical Subassembly for High Speed Optoelectronic Devices
Segmented Modulator for High-Speed Opto-Electronics
Method and Apparatus for Directly Modulating a Laser Diode Using Multi-Stage Driver Circuitry
Off-Chip Matching Circuit for Electroabsorption Optical Modulator
Method and System for Generating Short Pulse Signals
Interferometer Having Improved Modulation Depth and Free-Spectral Range and Method of Manufacturing
Electroabsorption Modulator with Tunable Chirp
Fiber Alignment Using a Channel Incorporating a Fulcrum Structure
Optical Device Having Dual Microstrip Transmission Lines with a Low-K Material and a Method of Manufacture Thereof
Devices and Method of Mounting
Monolithic Optical Device Manufacturing and Integration Methods
Silicon-Based High Speed Optical Wiring Board
Optical Device and Method of Manufacture Thereof
Optoelectronic Device, Method of Manufacturing Thereof, and System Including the Same
Doped-Absorber Graded Transition Enhanced Multiplication Avalanche Photodetector
Patent:
7,161,170 →
Application:
10/735,494 →
Electroabsorption Modulator
Optoelectronic Device and Method of Manufacture Thereof
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the 6,697,388 Previously Recorded on Reel 015748 Frame 0551. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Dec 13, 2011
From: AGERE SYSTEMS INC.
To: TRIQUINT TECHNOLOGY HOLDING COMPANY
Reel/Frame 027373/0268 →
Corrective Assignment to Correct the 6,697,388 Previously Recorded on Reel 015748 Frame 0548. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Dec 13, 2011
From: AGERE SYSTEMS INC.
To: TRIQUINT TECHNOLOGY HOLDING COMPANY
Reel/Frame 027372/0813 →
Corrective Assignment to Correct the 6,839,3364 Previously Recorded on Reel 015748 Frame 0548. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Dec 13, 2011
From: AGERE SYSTEMS INC.
To: TRIQUINT TECHNOLOGY HOLDING COMPANY
Reel/Frame 027372/0253 →
Corrective Assignment to Correct the 6,697,388 Previously Recorded on Reel 015583 Frame 0116. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Dec 13, 2011
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 027371/0081 →
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest
Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement
Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Merger
Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047196 Frame: 0097. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →