IP Library › Assignment 039050/0193
Patent Assignment
Reel/Frame 039050/0193

MERGER

Recorded: 2016-06-16 Received: 2016-06-16 Pages: 13
Assignor
TRIQUINT SEMICONDUCTOR, INC.
Executed: 2016-03-30
Assignee
QORVO US, INC.
7628 THORNDIKE ROAD, GREENSBORO, NC, 27409, UNITED STATES
Covered Applications (100)
APPARATUSES FOR EXTERNALLY CONTROLLING ARTICULATION OF A JOINT MOTION
App. No. 15/171,495
→
DUAL-SERIES VARACTOR EPI
App. No. 15/142,404
→
POWER PACKAGE LID
App. No. 15/140,928
→
MONOLITHIC WIDEBAND TRIFILAR TRANSFORMER
App. No. 15/141,296
→
SYSTEMS AND METHODS FOR CANCELLATION OF LEAKAGE INTO A RX PORT OF A DUPLEXER OR MULTIPLEXER
App. No. 15/139,775
→
SURFACE ACOUSTIC WAVE DEVICE HAVING A PIEZOELECTRIC LAYER ON A QUARTZ SUBSTRATE AND METHODS OF MANUFACTURING THEREOF
App. No. 15/086,895
→
GUIDED SURFACE ACOUSTIC WAVE DEVICE PROVIDING SPURIOUS MODE REJECTION
App. No. 15/086,936
→
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND PROCESS FOR MAKING THE SAME
App. No. 15/085,458
→
AIR GAP IN BAW TOP METAL STACK FOR REDUCED RESISTIVE AND ACOUSTIC LOSS
App. No. 15/059,789
→
SINGLE VARACTOR STACK WITH LOW SECOND-HARMONIC GENERATION
App. No. 15/005,235
→
POWER LIMITER
App. No. 14/978,346
→
METHOD OF FABRICATING A MULTI-CHANNEL MODULATOR DRIVER WITH ENCLOSURE
App. No. 14/810,681
→
Temperature Compensated Surface Acoustic Wave Device And Methods Of Manufacturing The Same
App. No. 14/730,001
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RESONATORS WITH BALANCING CAPACITOR
App. No. 14/716,582
→
SPURIOUS MODE SUPPRESSION IN BULK ACOUSTIC WAVE RESONATOR
App. No. 14/711,679
→
BODY DRIVEN POWER AMPLIFIER LINEARIZATION
App. No. 14/641,224
→
GALLIUM NITRIDE ON HIGH THERMAL CONDUCTIVITY MATERIAL DEVICE AND METHOD
App. No. 14/631,677
→
ULTRATHIN FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
App. No. 14/619,927
→
APPARATUSES AND SYSTEMS FOR A BIAS NETWORK WITH ACCURATE QUIESCENT CURRENT CONTROL
App. No. 14/610,873
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APPARATUSES, SYSTEMS, AND METHODS FOR DIE ATTACH COATINGS FOR SEMICONDUCTOR PACKAGES
App. No. 14/603,261
→
MODULAR SEMICONDUCTOR PACKAGE
App. No. 14/589,464
→
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
App. No. 14/580,147
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COMPOUND VARACTOR
App. No. 14/485,532
→
DIGITAL ALLOY LAYER IN A III-NITRADE BASED HETEROJUNCTION FIELD EFFECT TRANSISTOR
App. No. 14/480,404
→
QUADRATURE LATTICE MATCHING NETWORK
App. No. 14/338,262
→
METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICE
App. No. 14/337,093
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CLOCK GENERATION CIRCUIT WITH DUAL PHASE-LOCKED LOOPS
App. No. 14/303,550
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VARACTOR DIODE WITH HETEROSTRUCTURE
App. No. 14/280,404
→
DUAL STACK VARACTOR
App. No. 14/273,316
→
LOW NOISE AMPLIFIER DRAIN SWITCH CIRCUIT
App. No. 14/222,454
→
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
App. No. 14/221,182
→
BIAS CIRCUIT FOR A HIGH POWER RADIO FREQUENCY SWITCHING DEVICE
App. No. 14/196,987
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ELECTROSTATIC DISCHARGE PROTECTION DEVICE
App. No. 14/172,800
→
FIELD EFFECT TRANSISTOR SWITCHING CIRCUIT
App. No. 14/172,727
→
DOPED GALLIUM NITRIDE HIGH-ELECTRON MOBILITY TRANSISTOR
App. No. 14/157,245
→
EMITTER CONTACT EPITAXIAL STRUCTURE AND OHMIC CONTACT FORMATION FOR HETEROJUNCTION BIPOLAR TRANSISTOR
App. No. 14/157,096
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PASSIVE FEEDBACK PATH FOR PRE-DISTORTION IN POWER AMPLIFIERS
App. No. 14/153,935
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THRESHOLD VOLTAGE-TRACKING BIAS CIRCUIT FOR RADIO FREQUENCY POWER AMPLIFIER
App. No. 14/095,890
→
ADVANCED GROUNDING SCHEME
App. No. 14/062,494
→
Temperature Compensated Bulk Acoustic Wave Devices Using Over-Moded Acoustic Reflector Layers
App. No. 14/044,782
→
ELECTROSTATIC DISCHARGE (ESD) CIRCUITRY
App. No. 14/038,127
→
BIAS-BOOSTING BIAS CIRCUIT FOR RADIO FREQUENCY POWER AMPLIFIER
App. No. 14/011,315
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SPLIT BIASED RADIO FREQUENCY POWER AMPLIFIER WITH ENHANCED LINEARITY
App. No. 13/959,398
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HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE AND METHOD
App. No. 13/941,413
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VARIABLE TRANSMISSION LINE
App. No. 13/940,142
→
MONOLITHIC WIDEBAND HIGH POWER TERMINATION ELEMENT
App. No. 13/929,429
→
TRANSFORMER FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
App. No. 13/929,301
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FAST SETTLING CHARGE PUMP WITH FREQUENCY HOPPING
App. No. 13/908,781
→
FREQUENCY FILTER
App. No. 13/903,821
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POWER LIMITER
App. No. 13/801,929
→
HIGH COUPLING, LOW LOSS PBAW DEVICE AND ASSOCIATED METHOD
App. No. 13/801,145
→
BORDER RING MODE SUPPRESSION IN SOLIDLY-MOUNTED BULK ACOUSTIC WAVE RESONATOR
App. No. 13/796,824
→
ACOUSTIC WAVE DEVICE
App. No. 13/791,600
→
RADIO FREQUENCY SWITCH DEVICE WITH SOURCE-FOLLOWER
App. No. 13/774,928
→
SWITCHING DEVICE WITH DIODE-BIASED FIELD-EFFECT TRANSISTOR (FET)
App. No. 13/772,289
→
SWITCHING DEVICE WITH NEGATIVE BIAS CIRCUIT
App. No. 13/772,277
→
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
App. No. 13/769,729
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BODY-BIASED SWITCHING DEVICE
App. No. 13/764,655
→
SWITCHING DEVICE WITH RESISTIVE DIVIDER
App. No. 13/742,086
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RADIO FREQUENCY SWITCH CIRCUIT
App. No. 13/731,991
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ISOLATED EPITAXIAL MODULATION DEVICE
App. No. 13/717,917
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GROUP III-NITRIDE-BASED TRANSISTOR WITH GATE DIELECTRIC INCLUDING A FLUORIDE - OR CHLORIDE- BASED COMPOUND
App. No. 13/685,560
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SWITCHING DEVICE WITH NON-NEGATIVE BIASING
App. No. 13/587,590
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BODY-CONTACTED PARTIALLY DEPLETED SILICON ON INSULATOR TRANSISTOR
App. No. 13/535,203
→
GROUP III-NITRIDE TRANSISTOR USING A REGROWN STRUCTURE
App. No. 13/535,127
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METHOD OF MANUFACTURING AN ELECTROSTATIC PROTECTION DEVICE
App. No. 13/523,766
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GROUP III-NITRIDE TRANSISTOR WITH CHARGE-INDUCING LAYER
App. No. 13/481,198
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THERMAL VIA STRUCTURES WITH SURFACE FEATURES
App. No. 13/476,923
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THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS
App. No. 13/476,948
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POWER AMPLIFIER WITH FAST LOADLINE MODULATION
App. No. 13/460,513
→
RADIO FREQUENCY SWITCHING DEVICE WITH FAST TRANSIENT RESPONSE TIME
App. No. 13/455,998
→
RADIO FREQUENCY POWER AMPLIFIER WITH LOW DYNAMIC ERROR VECTOR MAGNITUDE
App. No. 13/434,734
→
DIRECTIONAL COUPLER ARCHITECTURE FOR RADIO FREQUENCY POWER AMPLIFIER
App. No. 13/363,905
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MIXER WITH HIGH SECOND-ORDER AND THIRD-ORDER INTERCEPT POINT
App. No. 13/333,925
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ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER
App. No. 13/309,424
→
TRANSISTOR GATE HAVING AN INSULATING LAYER SUPPORT STRUCTURE
App. No. 13/305,657
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DYNAMIC POWER LIMITER CIRCUIT
App. No. 13/296,164
→
TEMPERATURE COMPENSATION OF ACOUSTIC RESONATORS IN THE ELECTRICAL DOMAIN
App. No. 13/287,859
→
HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD
App. No. 13/282,371
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SHEET-MOLDED CHIP-SCALE PACKAGE
App. No. 13/252,083
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REGROWN SCHOTTKY STRUCTURES FOR GAN HEMT DEVICES
App. No. 13/115,913
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PROTECTION CIRCUIT FOR RADIO FREQUENCY POWER AMPLIFIER
App. No. 13/115,024
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ELASTIC GUIDED WAVE COUPLING RESONATOR FILTER AND ASSOCIATED MANUFACTURING
App. No. 13/110,518
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COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR DIRECT CURRENT TO DIRECT CURRENT CONVERTER
App. No. 13/109,958
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AIR CAVITY PACKAGE INCLUDING A PACKAGE LID HAVING AT LEAST ONE PROTRUSION CONFIGURED TO FACILITATE COUPLING OF THE PACKAGE LID WITH A PACKAGE WALL
App. No. 13/104,770
→
QUADRATURE LATTICE MATCHING NETWORK
App. No. 13/070,424
→
ISOLATED EPITAXIAL MODULATION DEVICE
App. No. 13/050,536
→
ACOUSTIC WAVE GUIDE DEVICE AND METHOD FOR MINIMIZING TRIMMING EFFECTS AND PISTON MODE INSTABILITIES
App. No. 13/041,653
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LADDER QUADRATURE HYBRID
App. No. 13/022,402
→
LINEAR VOLTAGE-CONTROLLED CURRENT SOURCE
App. No. 13/014,634
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LOGIC CIRCUIT WITHOUT ENHANCEMENT MODE TRANSISTORS
App. No. 12/980,264
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Wafer Level Package with Embedded Passive Components and Method of Manufacturing
App. No. 12/957,004
→
POWER DEVICES WITH INTEGRATED PROTECTION DEVICES: STRUCTURES AND METHODS
App. No. 12/950,202
→
POWER DEVICES WITH INTEGRATED PROTECTION DEVICES: STRUCTURES AND METHODS
App. No. 12/950,453
→
MONOLITHIC INTEGRATION OF GALLIUM NITRIDE AND SILICON DEVICES AND CIRCUITS, STRUCTURE AND METHOD
App. No. 12/946,669
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BULK ACOUSTIC WAVE RESONATOR
App. No. 12/989,488
→
DIE INCLUDING A GROOVE EXTENDING FROM A VIA TO AN EDGE OF THE DIE
App. No. 12/847,477
→
BALANCED SWITCH INCLUDING SERIES, SHUNT, AND RETURN TRANSISTORS
App. No. 12/832,911
→
BURIED IDT SAW FILTER HAVING LOW PROPAGATION LOSS
App. No. 12/829,101
→
SIMULTANEOUS HARMONIC TERMINATION IN A PUSH-PULL POWER AMPLIFIER
App. No. 12/828,134
→