IP Library › Granted Patent US 9,585,240
Granted Patent B2
US 9,585,240 · App. 14/062,494 · Granted Feb 28, 2017

Advanced grounding scheme

Inventors: Thomas R. Landon, Jr. (Plano, TX); Paul D. Bantz (Los Altos, CA); Tarak A. Railkar (Plano, TX)
Assignee: Qorvo US, Inc.
H05K1/0204H05K1/0207H05K1/0215H05K1/0216H05K3/4602H05K2201/0187H05K2201/10416H05K2203/0191Y10T29/49155
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Quick Facts
Patent No.
US 9,585,240
App. No.
14/062,494
Granted
Feb 28, 2017
Kind
B2
Abstract

A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

Claims (57)

1. An apparatus comprising:

a laminate core having a first cavity;

a slug having a first side and a second side opposite the first side of the slug, wherein the slug is positioned within the first cavity of the laminate core and coupled with the laminate core via an adhesive;

a capping layer having a first side directly coupled with the first side of the slug and a second side that is opposite the first side of the capping layer, wherein the capping layer is electronically conductive;

a first dielectric having a first side coupled with the second side of the capping layer and a second side opposite the first side of the first dielectric;

a routing layer having a first side coupled with the second side of the first dielectric and a second side opposite the first side of the routing layer, wherein the routing layer is electronically conductive; and

a second cavity in the first dielectric and the routing layer, and a plated element positioned within the second cavity, wherein the plated element has a first side that is directly coupled with the second side of the capping layer and a second side opposite the first side of the plated element.

2. The apparatus of claim 1 , wherein the slug is a copper slug.

3. The apparatus of claim 1 wherein the second side of the plated element is coplanar with the second side of the routing layer.

4. The apparatus of claim 1 , further comprising:

a second dielectric having a first side coupled with the second side of the routing layer and a second side opposite the first side of the second dielectric; and

an outer routing layer having a first side coupled with the second side of the second dielectric and a second side opposite the first side of the outer routing layer, wherein the outer routing layer is electronically conductive.

5. The apparatus of claim 4 further comprising:

a third cavity in the second dielectric and the outer routing layer, wherein

the second side of the plated element is exposed to the third cavity.

6. The apparatus of claim 1 , wherein the first side of the slug has a diameter greater than 200 micrometers.

7. The apparatus of claim 1 , wherein the laminate core is a dielectric core layer.

8. The apparatus of claim 1 , wherein the second side of the slug is coupled directly with a second routing layer.

9. The apparatus of claim 1 , wherein the second side of the slug is coplanar with a surface of the apparatus.

10. A system comprising:

a power amplification module;

a laminate substrate coupled with the power amplification module, the laminate substrate comprising:

a laminate core having a first cavity;

a slug having a first side and a second side opposite the first side of the slug, wherein the slug is positioned within the first cavity of the laminate core and coupled with the laminate core via an adhesive;

a capping layer having a first side directly coupled with the first side of the slug and a second side that is opposite the first side of the capping layer, wherein the capping layer is electronically conductive;

a first dielectric having a first side coupled with the second side of the capping layer and a second side opposite the first side of the first dielectric;

a routing layer having a first side coupled with the second side of the first dielectric and a second side opposite the first side of the routing layer, wherein the routing layer is electronically conductive; and

a second cavity in the first dielectric and the routing layer, and a plated element positioned within the second cavity, wherein the plated element has a first side that is directly coupled with the second side of the capping layer and a second side opposite the first side of the plated element.

11. The system of claim 10 , wherein the slug is a copper slug.

12. The system of claim 10 , wherein the second side of the plated element is coplanar with the second side of the routing layer.

13. The system of claim 10 , wherein the first side of the slug has a diameter greater than 200 micrometers.

14. The apparatus of claim 1 further comprising:

a second capping layer having a first side directly coupled with the second side of the slug and a second side that is opposite the first side of the second capping layer, wherein the second capping layer is electronically conductive;

a second dielectric having a first side coupled with the second side of the second capping layer and a second side opposite the first side of the second dielectric; and

a second routing layer having a first side coupled with the second side of the second dielectric and a second side opposite the first side of the second routing layer, wherein the second routing layer is electronically conductive.

15. An apparatus comprising:

a laminate core with a first cavity, wherein the laminate core has a first side coupled with the capping layer and a second side opposite the first side of the laminate core;

a slug having a first side and a second side opposite the first side of the slug, wherein the slug is positioned within the first cavity of the laminate core and coupled with the laminate core via an adhesive;

a capping layer having a first side directly coupled with the first side of the slug and a second side that is opposite the first side of the capping layer, wherein the capping layer is electronically conductive;

a first dielectric having a first side coupled with the second side of the capping layer and a second side opposite the first side of the first dielectric;

a routing layer having a first side coupled with the second side of the first dielectric and a second side opposite the first side of the routing layer, wherein the routing layer is electronically conductive;

a second dielectric over the second side of the laminate core;

a second routing layer over the second dielectric, wherein the second routing layer is electronically conductive;

a second cavity in the second dielectric and the second routing layer;

a third dielectric over the second routing layer;

a third routing layer over the third dielectric, wherein the third routing layer is electronically conductive; and

a third cavity in the third dielectric and the third routing layer, wherein the slug extends to the second cavity and the second side of the slug is exposed to the third cavity.

16. The apparatus of claim 1 wherein the plated element is electronically conductive.

17. The apparatus of claim 4 further comprising:

a third cavity in the second dielectric and the outer routing layer, wherein

a first portion of the plated element is positioned within the second cavity, and a second portion of the plated element is positioned within the third cavity such that the second side of the plated element is coplanar with a second side of the outer routing layer.

18. The system of claim 10 further comprising:

a second dielectric having a first side coupled with the second side of the routing layer and a second side opposite the first side of the second dielectric; and

an outer routing layer having a first side coupled with the second side of the second dielectric and a second side opposite the first side of the outer routing layer, wherein the outer routing layer is electronically conductive.

19. The system of claim 18 further comprising:

a third cavity in the second dielectric and the outer routing layer, wherein

the second side of the plated element is exposed to the third cavity.

Assignments (2)
MERGER Recorded Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2013
From: LANDON, THOMAS R., JR.; BANTZ, PAUL D.; RAILKAR, TARAK A.
To: TRIQUINT SEMICONDUCTOR, INC.
Reel/Frame 031473/0351 →
Continuity (1)
Related Publication 20150116947A1 · Apr 30, 2015