Patent Assignment
Reel/Frame 014555/0129
Assignment of Assignor's Interest
Recorded: 2003-10-06
Pages: 3
Assignors
HARELAND, SCOTT A.
Executed: 2003-09-18
CHAU, ROBERT S.
Executed: 2003-09-18
DOYLE, BRIAN
Executed: 2003-09-17
DATTA, SUMAN
Executed: 2003-09-17
JIN, BEEN-YIH
Executed: 2003-09-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Nonplanar Device with Stress Incorporation Layer and Method of Fabrication