Patent Assignment
Reel/Frame 014561/0692
Assignment of Assignor's Interest
Recorded: 2003-09-25
Pages: 3
Assignors
LEONG, KUM FOO
Executed: 2003-09-25
CHUNG, CHEE KEY
Executed: 2003-09-25
SIM, KIAN SIN
Executed: 2003-09-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Stitched Micro-via to Enhance Adhesion and Mechanical Strength
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.