Patent Assignment
Reel/Frame 014566/0215
Assignment of Assignor's Interest
Recorded: 2003-10-07
Pages: 3
Assignor
NAKAI, TORU
Executed: 2003-04-03
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU 503-0917, JAPAN
Covered Property
(1)
Printed Wiring Board and Production Method for Printed Wiring Board