Patent Assignment
Reel/Frame 014574/0802
Assignment of Assignor's Interest
Recorded: 2003-09-26
Pages: 4
Assignors
ARVELO, AMILCAR R.
Executed: 2003-09-25
SIKKA, KAMAL KUMAR
Executed: 2003-09-25
TOY, HILTON T.
Executed: 2003-09-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10598
Covered Property
(1)
Method and Structure for Cooling a Dual Chip Module with One High Power Chip