IP Library Assignment 014582/0541
Patent Assignment
Reel/Frame 014582/0541

Assignment of Assignor's Interest

Recorded: 2003-10-09 Pages: 2
Assignors
CHEUNG, YIU MING
Executed: 2003-08-07
CHONG, CHI MING
Executed: 2003-08-07
LEE, TAT WING
Executed: 2003-08-07
LEUNG, KA LOK
Executed: 2003-08-07
Assignee
ASM ASSEMBLY AUTOMATION LTD.
20/F, WATSON CENTRE, 16-22 KUNG YIP STREET, KWAI CHUNG, HONG KONG
Covered Property (1)
Apparatus and Method for Thin Die Detachment
Patent: 8,026,126 →
Application: 10/628,503 →
Publication: US 2004/0115904
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →