Assignment of Assignor's Interest

Recorded: 2003-10-15 Received: 2003-10-21 Pages: 4

Assignor

HITACHI, LTD.

Executed: 2003-09-12

Assignee

RENESAS TECHNOLOGY CORPORATION

4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN

Covered Properties (6)

Method of Making a Material

Application: 10/682,288 →

Mold Cleaning Sheet and Method for Producing Semiconductor Devices Using the Same

Application: 10/296,724 →

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Application: 10/227,817 →

Semiconductor Device and a Method of Manufacturing the Same

Application: 10/108,439 →

Mold Cleaning Sheet and Manufacturing Method of a Semiconductor Device Using the Same

Application: 10/086,691 →

Semiconductor Package with Elevated Tub

Application: 09/988,645 →