Patent Assignment
Reel/Frame 014617/0707
Assignment of Assignor's Interest
Recorded: 2003-10-15
Pages: 5
Assignor
VOELZ, JAMES L.
Executed: 2003-10-09
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83706-9632
Covered Property
(1)
Methods for Wafer-Level Packaging of Microelectronic Devices and Microelectronic Devices Formed by Such Methods
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.