Patent Assignment
Reel/Frame 014618/0557
Assignment of Assignor's Interest
Recorded: 2003-10-14
Pages: 2
Assignors
YANG, WEI-SHENG
Executed: 2003-07-04
CHU, CHIH-LIANG
Executed: 2003-07-04
WEI, KUO-SHENG
Executed: 2003-07-04
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, ROC, TAIWAN
Covered Property
(1)
Method of Plating Metal Layer Over Isolated Pads on Semiconductor Package Substrate