Patent Assignment
Reel/Frame 014632/0307
Assignment of Assignor's Interest
Recorded: 2003-10-22
Pages: 3
Assignors
MINAMIO, MASANORI
Executed: 2003-10-20
HORIKI, HIROSHI
Executed: 2003-10-20
NISHIO, TETSUSHI
Executed: 2003-10-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Leadframe, Plastic-Encapsulated Semiconductor Device, and Method for Fabricating the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 19, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 033777/0873 →
Assignment of Assignor's Interest
Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
Assignment of Assignor's Interest
Jan 25, 2016
From: PANNOVA SEMIC, LLC
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 037581/0466 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →