Patent Assignment
Reel/Frame 014638/0942
Assignment of Assignor's Interest
Recorded: 2003-10-22
Pages: 2
Assignors
HOU, CHUAN-PING
Executed: 2003-10-21
JANG, SYUN-MING
Executed: 2003-10-21
CHEN, YING-HO
Executed: 2003-10-21
TSENG, TUNG-CHING
Executed: 2003-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 6, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming a Contact on a Silicon-on-Insulator Wafer