IP Library Assignment 014644/0579
Patent Assignment
Reel/Frame 014644/0579

Assignment of Assignor's Interest

Recorded: 2003-10-27 Pages: 3
Assignor
JANG, BONG-JUN
Executed: 2003-10-01
Assignee
SAMSUNG ELECTRICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-GO, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Pe-Teos Layer of Semiconductor Integrated Circuit Device
Patent: 7,268,089 →
Application: 10/693,457 →
Publication: US 2004/0106302
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 19, 2020
From: SAMSUNG ELECTRONICS CO., LTD.
To: LONGITUDE FLASH MEMORY SOLUTIONS LIMITED
Reel/Frame 052698/0150 →