IP Library Assignment 052698/0150
Patent Assignment
Reel/Frame 052698/0150

Assignment of Assignor's Interest

Recorded: 2020-05-19 Pages: 6
Assignor
SAMSUNG ELECTRONICS CO., LTD.
Executed: 2019-05-10
Assignee
LONGITUDE FLASH MEMORY SOLUTIONS LIMITED
BRACKEN ROAD, SANDYFORD, FIRST FLOOR, BLACKTHORN EXCHANGE, DUBLIN, D18 P3Y9, IRELAND
Covered Properties (11)
Method for Forming Pe-Teos Layer of Semiconductor Integrated Circuit Device
Patent: 7,268,089 →
Application: 10/693,457 →
Publication: US 2004/0106302
Alignment Measuring System and Method of Determining Alignment in a Photolithography Process
Patent: 7,242,476 →
Application: 10/821,890 →
Publication: US 2004/0263828
Integrated Circuit Semiconductor Device with Overlay Key and Alignment Key and Method of Fabricating the Same
Patent: 7,381,508 →
Application: 10/867,468 →
Publication: US 2005/0031995
Method and Apparatus for Inspecting a Wafer Surface
Patent: 7,310,140 →
Application: 10/877,684 →
Publication: US 2004/0263836
Integrated Circuit Semiconductor Device with Overlay Key and Alignment Key and Method of Fabricating the Same
Patent: 8,080,886 →
Application: 12/111,651 →
Publication: US 2008/0203590
Output Driver Operable Over Wide Range of Voltages
Patent: 8,154,323 →
Application: 12/771,034 →
Publication: US 2011/0025380
Security Circuit Having an Electrical Fuse Rom
Patent: 8,258,809 →
Application: 13/090,755 →
Publication: US 2011/0199809
Apparatus for Cleaning an Object and Method of Operating the Same
Patent: 9,129,998 →
Application: 13/438,327 →
Publication: US 2012/0260945
Apparatus for Cleaning Photomask
Patent: 9,122,177 →
Application: 13/785,798 →
Publication: US 2013/0186436
Apparatus for Testing a Semiconductor Package
Patent: 9,244,119 →
Application: 14/059,916 →
Publication: US 2014/0253168
Semiconductor Package and Method of Manufacturing the Same
Patent: 9,324,661 →
Application: 14/673,852 →
Publication: US 2015/0279787
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2003
From: JANG, BONG-JUN
To: SAMSUNG ELECTRICS CO., LTD.
Reel/Frame 014644/0579 →
Assignment of Assignor's Interest Jun 25, 2004
From: EOM, TAE-MIN; YANG, YU-SIN; JUN, CHUNG-SAM; JEE, YUN-JUNG
To: SAMSUNG ELECTRONICS, CO., LTD.
Reel/Frame 015524/0491 →
Assignment of Assignor's Interest Aug 24, 2004
From: KIM, YOUNG-LAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015081/0175 →
Assignment of Assignor's Interest Oct 25, 2004
From: KANG, CHANG-JIN; KIM, MYEONG-CHEOL; RYOO, MAN-HYOUNG; LEE, SI-HYEUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015915/0765 →
Assignment of Assignor's Interest Apr 30, 2010
From: KIM, EON-GUK; KIM, DAE-GYU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 024316/0244 →
Assignment of Assignor's Interest Apr 3, 2012
From: KIM, GWANG-SICK; KIM, SEUNG-GEUN; LEE, SUNG-SOO; LEE, JAE-NAM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 027980/0189 →
Assignment of Assignor's Interest Oct 22, 2013
From: CHOI, GUI-HEUM; KIM, IN-SIK; SHIM, BO-KEUN; LIM, SUNG-JAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031453/0433 →
Assignment of Assignor's Interest Mar 30, 2015
From: KIM, DOO-JIN; KIM, YOUNG-SIK; UM, TEA-SEOG; HA, YONG-DAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 035293/0063 →
Patent Security Agreement (Short-Form) Feb 2, 2022
From: EVERI HOLDINGS INC.
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 058948/0265 →
Termination and Release of Patent Security Agreement Recorded at Reel 058948, Frame 0265 Jul 1, 2025
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: EVERI HOLDINGS INC.
Reel/Frame 071791/0236 →