Patent Assignment
Reel/Frame 035293/0063
Assignment of Assignor's Interest
Recorded: 2015-03-30
Pages: 6
Assignors
KIM, DOO-JIN
Executed: 2015-01-18
KIM, YOUNG-SIK
Executed: 2015-01-18
UM, TEA-SEOG
Executed: 2015-01-18
HA, YONG-DAE
Executed: 2015-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.