Patent Assignment
Reel/Frame 015524/0491
Assignment of Assignor's Interest
Recorded: 2004-06-25
Pages: 3
Assignors
EOM, TAE-MIN
Executed: 2004-06-18
YANG, YU-SIN
Executed: 2004-06-15
JUN, CHUNG-SAM
Executed: 2004-06-15
JEE, YUN-JUNG
Executed: 2004-06-15
KIM, JOUNG-SOO
Executed: 2004-06-16
KIM, MOON-KYUNG
Executed: 2004-06-14
CHON, SANG-MUN
Executed: 2004-06-16
CHOI, SUN-YONG
Executed: 2004-06-01
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO, SUWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Inspecting a Wafer Surface
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.