Patent Assignment
Reel/Frame 014667/0331
Assignment of Assignor's Interest
Recorded: 2003-11-03
Pages: 3
Assignors
BOWER, BRADLEY
Executed: 2003-10-29
QI, QUAN
Executed: 2003-10-29
SAND, KIRBY
Executed: 2003-10-29
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
System and a Method for Fluid Filling Wafer Level Packages
Patent:
6,858,466 →
Application:
10/700,713 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Execution Date of the Assignor's, Previously Recorded on Reel 014667 Frame 0331.
Jul 12, 2004
From: BOWER, BRADLEY; QI, QUAN; SAND, KIRBY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015551/0899 →
Assignment of Assignor's Interest
Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →