Patent Assignment
Reel/Frame 014689/0046
Assignment of Assignor's Interest
Recorded: 2003-11-06
Pages: 3
Assignor
SHIN, HYOUN SOO
Executed: 2003-10-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, PALDAL-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Gan Led for Flip-Chip Bonding and Method of Fabricating the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.