IP Library › Assignment 014699/0064
Patent Assignment
Reel/Frame 014699/0064

Assignment of Assignor's Interest

Recorded: 2003-11-18 Pages: 4
Assignor
Assignee
TOUCH FUTURE TECHNOLOGY LTD.
1 HARBOUR STREET, 18/F, ONE INTERNATIONAL FINANCE CENTER, HONG KONG, CHINA
Covered Properties (7)
Sequentially Built Integrated Circuit Package
Patent: 6,107,683 →
Application: 09/075,286 →
Method for Making a Substrate for an Integrated Circuit Package
Patent: 6,248,612 →
Application: 09/376,919 →
Substrate for an Integrated Circuit Package
Patent: 6,501,168 →
Application: 09/388,332 →
Ball Grid Substrate for Lead-on-Chip Semiconductor Package
Patent: 6,534,861 →
Application: 09/440,630 →
Electrical Circuit and Method of Formation
Patent: 6,801,438 →
Application: 09/695,353 →
Ball grid substrate for lead-on-chip semiconductor package
Patent: 6,300,165 →
Application: 09/765,004 →
Publication: US 2001/0002321
Ball grid substrate for lead-on-chip semiconductor package
Application: 10/348,842 →
Publication: US 2003/0132518