Patent Assignment
Reel/Frame 014702/0282
Assignment of Assignor's Interest
Recorded: 2003-11-13
Pages: 2
Assignor
HSU, JIMMY
Executed: 2003-09-26
Assignee
VIA TECHNOLOGIES, IC.
8F, 533, CHUNG-CHENG RD., HSIN TIEN, TAIPEI, R.O.C., TAIWAN
Covered Property
(1)
Bonding Pad Design for Impedance Matching Improvement