Patent Assignment
Reel/Frame 014716/0637
Assignment of Assignor's Interest
Recorded: 2003-11-18
Pages: 3
Assignor
FUJISAWA, HIROMI
Executed: 2003-11-11
Assignee
KAIJO CORPORATION
1-5, SAKAECHO 3-CHOME, HAMURA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wire Loop, Semiconductor Device Having Same, Wire Bonding Method and Wire Bonding Apparatus