Patent Assignment
Reel/Frame 014720/0919
Assignment of Assignor's Interest
Recorded: 2003-11-24
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Polymer Solder Hybrid Interface Material with Improved Solder Filler Particle Size and Microelectronic Package Application