Patent Assignment
Reel/Frame 014724/0410
Assignment of Assignor's Interest
Recorded: 2004-06-11
Pages: 3
Assignors
LEE, DANIEL
Executed: 2004-04-28
HUANG, CHENDER
Executed: 2004-04-28
LEE, C. H.
Executed: 2004-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Thermal Dispensing Enhancement for High Performance Flip Chip Bga (Hpfcbga)