Patent Assignment
Reel/Frame 014729/0823
Assignment of Assignor's Interest
Recorded: 2003-11-19
Pages: 3
Assignors
HUANG, TAI-CHUN
Executed: 2003-11-04
YAO, CHIH-HSIANG
Executed: 2003-11-04
HSIEH, CHING-HUA
Executed: 2003-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Bond Pad for Flip Chip Package