IP Library Assignment 014732/0161
Patent Assignment
Reel/Frame 014732/0161

Assignment of Assignor's Interest

Recorded: 2003-11-26 Received: 2003-12-02 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Method of Manufacturing a Semiconductor Device Using a Mold
Application: 10/453,606 →