Patent Assignment
Reel/Frame 014732/0161
Assignment of Assignor's Interest
Recorded: 2003-11-26
Received: 2003-12-02
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Using a Mold
Application:
10/453,606 →