IP Library Granted Patent US 6,723,583
Granted Patent Utility
US 6,723,583 · Confirmation No. 3128

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A MOLD

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Code Description Pages PDF
2004-02-20 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-02-20 C.AD Change of Address 1 View
2003-06-04 TRNA Transmittal of New Application 3 View
2003-06-04 A.PE Preliminary Amendment 14 View
2003-06-04 SPEC Specification 61 View
2003-06-04 CLM Claims 12 View
2003-06-04 ABST Abstract 1 View
2003-06-04 DRW Drawings-only black and white line drawings 41 View
2003-06-04 OATH Oath or Declaration filed 6 View
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Quick Facts
Patent No.
US 6,723,583
App. No.
10/453,606
Filed
2003-06-04
Granted
2004-04-20
Pub. No.
US20030205797A1
Art Unit
2813
PTA
0 days