Patent Assignment
Reel/Frame 014741/0061
Assignment of Assignor's Interest
Recorded: 2003-11-24
Pages: 3
Assignors
MEGURO, KOUICHI
Executed: 2003-11-05
NISHINO, TORU
Executed: 2003-11-05
HAYASAKA, NOBORU
Executed: 2003-11-12
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Substrate Sheet Material for a Semiconductor Device and a Manufacturing Method Thereof, a Molding Method Using a Substrate Sheet Material, a Manufacturing Method of Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name
Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
Assignment of Assignor's Interest
Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0337 →