Patent Assignment
Reel/Frame 014759/0354
Assignment of Assignor's Interest
Recorded: 2004-06-21
Pages: 3
Assignors
PARK, JEONG-HUN
Executed: 2004-03-18
CHAE, HEE-SUN
Executed: 2004-03-18
PARK, KYOUNG-SHIN
Executed: 2004-03-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Process for Removing Defects Due to Edge Chips of a Semiconductor Wafer and Semiconductor Device Fabricated Thereby