Patent Assignment
Reel/Frame 014781/0900
Assignment of Assignor's Interest
Recorded: 2003-12-10
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 6. LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C, TAIWAN
Covered Property
(1)
Structure and Method for Reinforcing a Bond Pad on a Chip