Patent Assignment
Reel/Frame 014783/0676
Assignment of Assignor's Interest
Recorded: 2003-12-08
Pages: 3
Assignors
KUO, NICK
Executed: 2003-09-10
CHOU, CHIU-MING
Executed: 2003-09-10
CHOU, CHIEN-KANG
Executed: 2003-09-10
LIN, CHU-FU
Executed: 2003-09-10
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Chip Structure with Pads Having Bumps or Wirebonded Wires Formed Thereover or Used to Be Tested Thereto
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →