Assignment of Assignor's Interest

Recorded: 2003-12-18 Pages: 2

Assignor

LEE, TSUNG-LUNG

Executed: 2003-12-09

Assignee

ADVANCED THERMAL TECHNOLOGIES

2F, NO. 31, ALLEY 1, LANE 342, FU-TEH 1ST RD, HSI CHIH CITY, TAIPEI HSIEN, R.O.C., TAIWAN

Covered Property (1)

Chip assembly with glue-strengthening holes

Application: 10/737,906 →

Publication: US 2005/0133908

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.